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Photolithography
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Exposure of standard glass substrates, ceramic substrates, special substrates, overlapping
of several structure layers
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Parameters
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Photolithographic structuring
- exposure of standard glass substrates:
4"x4", 5"x5", thickness: 1 to 3mm
- exposure of ceramic sustrates
- other dimensions and materials
to order
- image scale:
1:5
- usable mask format:
5"x5"
- resolution capacity / image field size:
| numeric aperture |
ø 0,25 |
ø 0,29 |
ø 0,35 |
| resolution capacity (µm) |
1,4 |
1,2 |
1,0 |
| image field size (mm2) |
20x20 |
16x16 |
12x12 |
- production of graduated plates in the above dimensions
using the lift-off process or etched graduations
- coatings:
chromium (chromium coatings using Diadur 1/2/3/4), silver,
aluminium
- units:
GCA 8000 - Wafer Stepper Exposure Systems,
AÜR 2 - automatic cover repeater
(modified -
Jenoptik GmbH)
Projection and contact copy
- production of graduated plates, arcs and other graduated
optics
- dimensions up to 200 x 200 mm
- resolution:
approx. 3µm
- units:
Suess Maskaligner, JUB 80 (Carl Zeiss Jena), JUB 2104 (Elektromat Dresden)
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